ASTM B32 PDF

Historical Version s - view previous versions of standard. Work Item s - proposed revisions of this standard. More B This specification covers solder metal alloys also known as soft solders used in non-electronic applications, including but not limited to, tin-lead, tin-antimony, tin-antimony-copper-silver, tin-antimony-copper-silver-nickel, tin-silver, tin-copper-silver, and lead-tin-silver, used for the purpose of joining together two or more metals at temperatures below their melting points.

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Historical Version s - view previous versions of standard. Work Item s - proposed revisions of this standard. More B This specification covers solder metal alloys also known as soft solders used in non-electronic applications, including but not limited to, tin-lead, tin-antimony, tin-antimony-copper-silver, tin-antimony-copper-silver-nickel, tin-silver, tin-copper-silver, and lead-tin-silver, used for the purpose of joining together two or more metals at temperatures below their melting points.

Included here are solders in the form of solid bars, ingots, powder and special forms, and in the form of solid and flux-core ribbons, wires, and solder pastes.

Electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications are not taken into account here. Solders shall also meet physical property requirements such as paste texture, powder mesh size, viscosity, solder pool, and dryness, and pass performance requirements such as chlorides and bromides test, copper mirror test, and visual inspection.

Other properties to which the alloys should conform to are dimensions and unit weights, spread factor, and resistivity of water extract. This abstract is a brief summary of the referenced standard. It is informational only and not an official part of the standard; the full text of the standard itself must be referred to for its use and application.

ASTM does not give any warranty express or implied or make any representation that the contents of this abstract are accurate, complete or up to date. Electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications are not covered by this specification as they are under the auspices of IPC — Association Connecting Electronic Industries.

The values given in parentheses are mathematical conversions to SI units that are provided for information only and are not considered standard.

Referenced Documents purchase separately The documents listed below are referenced within the subject standard but are not provided as part of the standard.

Scope 1. Link to Active This link will always route to the current Active version of the standard.

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ASTM B32.pdf

Standard Specification for Solder Metal1 This standard is issued under the fixed designation B 32; the number immediately following the designation indicates the year of original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A superscript epsilon e indicates an editorial change since the last revision or reapproval. This standard has been approved for use by agencies of the Department of Defense. Alloys for Determination of Chemical Composition6 1.

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Standard Specification for Solder Metal

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